TRANSFER MECHANISM FOR QUADRILATERAL SUBSTRATE AND POLISHING DEVICE FOR QUADRILATERAL SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a transfer mechanism capable of transferring a quadrilateral substrate and a polishing device capable of polishing the quadrilateral substrate. SOLUTION: The transfer mechanism for the quadrilateral substrate transferring the quadrilateral substrate has a substrate pedestal 107 receiving the substrate W and a horizontally sliding second positioning pin 112 composed so as to position the substrate W mounted on the substrate pedestal 107 to the transfer mechanism. The polishing device for the quadrilateral substrate is provided with a polishing head 21 composed so as to hold the substrate W for polishing it, a pusher 101 used as a transfer mechanism composed so as to press the substrate W for holding it against the polishing head, and a first positioning pin 111 provided on the pusher 101 or the polishing head 21 with an axis directed in a pressing direction of the pusher 101 and composed so as to carry out relative positioning between the pusher 101 and the polishing head 21.