| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem of improving polishing accuracy where a workpiece of a monocrystalline silicon wafer used for a substrate or the like of a semiconductor integrated circuit is diametrally enlarged year by year and accuracy is becoming more strict than the present, and a problem of stopping a workpiece carrier of a planetary gear system at a home position since a demand is rising to reduce costs by automatic attachment and detachment of the workpiece to a polisher. SOLUTION: The polisher is miniaturized more than a conventional one by concentrically attaching one workpiece to one workpiece carrier, and since only revolution is needed, the workpiece can be automatically attached and detached easily. |
