Image sensor of a quad flat package

摘要

An image sensor of a quad flat non-leaded package (QFN). The image sensor of a quad flat non-leaded package includes a lead frame having a plurality of leads and a die pad, and the leads are located around a periphery of the die pad. A molding structure is formed around an outer boundary of the leads and located on a first surface of the lead frame. A plurality of bonding pads is formed on the active surface of a chip. A plurality of wires is utilized to electrically connect the bonding pads respectively to bonding portions of the leads on a first surface of the lead frame. A liquid compound is filled in between the chip and the molding structure and covering portions of the leads, A transmittance lid is allocated over the active surface, sealing the space between the molding structure and the lead frame.