Electronic chip package

摘要

An electronic chip package is provided having a laminated substrate. The laminated substrate includes at least one conductive layer and at least one dielectric layer which is bonded to the conductive layer. The dielectric layer has a glass transition temperature Tg greater than 200° C. and a volumetric coefficient of thermal expansion of <=75 ppm/° C. A semiconductor device is electrically attached to the laminated substrate.