发明名称 |
Method for measuring a thickness profile and a refractive index using white-light scanning interferometry and recording medium therefor |
摘要 |
A method and a recording medium for measuring three-dimensional thickness profile and refractive index of transparent dielectric thin-film with some patterns or not, which is fabricated in the semiconductor and related industrial field, using white-light scanning interferometry is provided.A method for measuring a thickness profile using white-light scanning interferometry in optical system includes the following steps. A first step is to extracting a phase graph by acquiring an interference signal and performing Fourier transform. A second step is to extracting a mathematical phase graph through modeling of a measurement object. And a third step is to measuring a profile value and a thickness value by applying an optimization technique to an error function determined by using phase values which is acquired from said first step and said second step.
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申请公布号 |
US6545763(B1) |
申请公布日期 |
2003.04.08 |
申请号 |
US20000533157 |
申请日期 |
2000.03.23 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
KIM SEUNG WOO;KIM GEE HONG |
分类号 |
G01B9/02;G01B11/06;(IPC1-7):G01B9/02 |
主分类号 |
G01B9/02 |
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