| 摘要 |
An integrated circuit device includes a semiconductor chip, a circuit board and a layer of bonding material. The semiconductor chip has a metal plated surface on a first side and has a predetermined thickness. A first conductive layer formed of electrically conductive material is bonded to a first side of a first dielectric layer and defines a plurality of conducting elements. A second conductive layer defining a first electrical ground plane and formed of electrically conductive material is bonded to a second side of the first dielectric layer opposite the first conductive layer. The circuit board has a pocket formed therein, passing through the first conductive layer and through the first dielectric layer. The pocket is closed on the second side by the second conductive layer. A portion of the second conductive layer is exposed at a bottom of the pocket. The pocket is of substantially the same size and shape as the semiconductor chip. The pocket receives the semiconductor chip with the first side of the semiconductor chip disposed toward the second conductive layer. A layer of conductive bonding material is disposed in the pocket between the metal plated surface of the semiconductor chip and the second conductive layer. The layer of bonding material mechanically and electrically connects the semiconductor chip to the second conductive layer.
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