| 摘要 |
PROBLEM TO BE SOLVED: To provide an infrared transmitting/receiving module which can be mounted at its upper face and side face, can reduce its mounting space and can be automatically mounted. SOLUTION: A light emitting element 12, a light receiving element 14 and a circuit part 16 are mounted on a substrate 10. These are sealed with light- transmitting resin 20 and further covered with a cover 22. Mounting electrodes 18 are formed at one side of the substrate 10 as extended from its bottom face to one side face. These mounting electrodes 18 can be connected to connection patterns 24a on a circuit substrate 24, even when any of bottom and side faces of the substrate 10 is to be mounted on the circuit substrate 24. |
