| 摘要 |
PURPOSE: An adhesive film for protecting the surface of a semiconductor wafer is provided to prevent the semiconductor wafer from being damaged or contaminated in polishing the back surface of the wafer by using an adhesive film having excellent adhesion, a damage preventing property and non-staining. CONSTITUTION: At least one intermediate layer and an adhesive layer are formed on one surface of a base material film. A minimum(G'min) of storage elastic modulus(G') at 50 to 100 deg.C in the adhesive layer(B) is 0.07 to 5 MPa, storage elastic modulus at 50 deg.C in at least one layer(C) of the intermediate layer is 0.001 MPa or more and less than 0.07 MPa, and the total thickness(tc, unit:micrometer) of the thickness(tb, unit:micrometer) of the adhesive layer(B) and the intermediate layer(C) having the storage elastic modulus satisfies a relation of the below-mentioned numerical expression, tc≧3tb.
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