METHOD FOR ELIMINATING PLATING LAYER ON LEADFRAME

摘要

PURPOSE: A method for eliminating a plating layer on a leadframe is provided to recycle the leadframe while using a conventional rework apparatus by eliminating a plating layer composed of a material like a tin-bismuth alloy whose critical point between over-etching and non-etching is difficult to determine. CONSTITUTION: A leadframe having the plating layer is dipped into chemical liquid including acid and additive(120). The leadframe from which the plating layer is removed is rinsed(130). The rinsed leadframe is dried(140). The leadframe is cleaned with ultrasonic(150). The leadframe is dried(160). The leadframe from which the plating layer is eliminated is inspected(170).