| 摘要 |
PURPOSE: To provide a semiconductor device that can package a substrate such as a chip having relatively a large surface area onto other substrates such as a chip-mounting substrate with high junction properties by a bonding method utilizing ultrasonic vibration without generating any resonance due to the ultrasonic vibration, and to provide a method for manufacturing the semiconductor device. CONSTITUTION: The semiconductor device has a first substrate 1 having a plurality of electrode sections 2a at one side, a second substrate 6 having a plurality of electrode sections 7a at one side, and a plurality of conductors 3a for connection that connect the plurality of electrode sections 2a on the first substrate 1 to the plurality of electrode sections 7a on the second substrate 6. In this case, support members 2b, 3b, and 7b for supporting the first and second substrates 1 and 6 are provided at a position that inhibits resonance due to ultrasonic vibration when the ultrasonic vibration is given from the outside while the first substrate 1 is being connected to the second substrate 6. |
