MULTI-CHIP MODULES PACKAGE

摘要

PURPOSE: A MCM(Multi-Chip Modules) package is provided to reduce total thickness without wire-bond interconnections. CONSTITUTION: An MCM tile(11) includes a substrate(15) with a plurality of peripheral metallizations(19) and at least one chip flip-chip mounted on the substrate(15). A PWB(Printed Wiring Board)(12) is provided with an aperture which is smaller than the size of the silicon substrate but larger than the outside dimensions of the mounted chips. The substrate(15) is positioned on the PWB so that its ends overlap areas of the PWB adjacent the aperture and the chips fit into the aperture. The peripheral metallizations(19) on the substrate are interconnected to metallizations on the PWB by either solder reflow technology or conductive adhesive technology.