BAKING APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A baking apparatus for fabricating a semiconductor device is provided to prevent a semiconductor substrate from being installed over a guide by mounting an optical sensor capable of inspecting a settlement state of the semiconductor substrate on a cover or the guide. CONSTITUTION: The semiconductor substrate(W) is placed on a baking plate(200). The baking plate heats the substrate to harden a layer on the substrate. A concave part on which the baking plate is placed is formed in a panel(202). The cover(206) is formed on the baking plate. The cover is closely attached to the panel to cover the baking plate when the substrate is heated. A sensing unit is installed in the bottom surface of the cover. The sensing unit senses the settlement state of the substrate placed on the baking plate.