BONDING WIRE, HIGH-FREQUENCY AMPLIFICATION MODULE USING THE SAME, AND POWER DISTRIBUTION/SYNTHESIS CIRCUIT

摘要

PROBLEM TO BE SOLVED: To enable semiconductor elements included in a high-frequency amplification module or the like to be set uniform in characteristics by a simple adjustment in a resistance value. SOLUTION: Dielectric boards 12 each having a microstrip line 13 are mounted on the base board 17 of a high-frequency package 16, and semiconductor elements 11a and 11b are each arranged between the dielectric boards 12. The semiconductor element 11a having a higher gain than the other semiconductor element 11b and the microstrip line 13 located on the dielectric board 12 are connected together with a resistive bonding wire 14 which is increased in resistivity by loading it with impurities of high resistivity. By this setup, an insertion loss caused by the resistance component of the resistive bonding wire 14 is increased, so that the semiconductor elements can be finely regulated in gain.