发明名称 METHOD FOR MANUFACTURING FERROELECTRIC MEMORY TRANSISTOR
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a 1-transistor ferroelectric memory device. SOLUTION: The method for manufacturing the ferroelectric memory device comprises a step of regulating a silicon substrate including a step of forming a plurality of active regions thereon, a step of depositing a polysilicon layer on a gate insulator layer by depositing the insulator layer on the substrate, a step of forming a drain region and a gate electrode, a step of finishing a lower electrode without imparting damage to the insulator layer and the substrate disposed thereunder by depositing a lower electrode material layer, a step of depositing a ferroelectric material layer on the lower electrode, a step of depositing the upper electrode material layer on the ferroelectric material layer, a step of etching a contact hole, and a step of finishing the transistor including a step of metallizing.
申请公布号 JP2003100997(A) 申请公布日期 2003.04.04
申请号 JP20020221370 申请日期 2002.07.30
申请人 SHARP CORP 发明人 SHIEN TEN SUU;LI TINGKAI;ULRICH BRUCE D
分类号 H01L27/105;H01L21/00;H01L21/28;H01L21/302;H01L21/336;H01L21/461;H01L21/822;H01L21/8239;H01L21/8242;H01L21/8246;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/105;H01L21/824 主分类号 H01L27/105
代理机构 代理人
主权项
地址