| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that stress being applied to a translucent cover after sealing increases as a container for an optical semiconductor element, e.g. an imaging element, decreases in size and thickness and the cover is removed from the container. SOLUTION: The container for an optical semiconductor element comprises an insulating basic body 1 having a part 1a for mounting an optical semiconductor element S on the upper surface thereof, a metal frame 2 bonded to the upper surface of the insulating basic body 1 through a sealant 7 while surrounding the mounting part 1a and forming an inner cavity for accommodating the optical semiconductor element S, and a translucent cover 3 bonded to the upper surface of the metal frame 2 through a glass bonding material 8 and accommodating the optical semiconductor element S hermetically in the cavity wherein an active metal solder layer 9 containing at least one kind of titanium, zirconium and hafnium is formed on the surface of the metal frame 2 being boded to the glass bonding material 8.</p> |
