ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND CIRCUIT BOARD PACKAGING THE SAME

摘要

PROBLEM TO BE SOLVED: To increase productivity to packaging onto a substrate regarding electronic components to be packaged onto the substrate. SOLUTION: The electronic component has an IC chip 9 that is formed in a plate shape, a connection electrode 8 that is provided at the one surface side, and a salient electrode 10 that is connected to the connection electrode 8 of the IC chip 9. In this case, with the formation surface of the connection electrode 8 of the IC chip 9, the tip of the salient electrode 10 is exposed for covering with a protection layer 11 made of resin.