摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic board on which a pad can be surely formed into a protruding dome-shape. SOLUTION: The method of manufacturing the laminated ceramic board comprises a mounting process in which a ceramic green sheet G for a mounting face with a formed through hole H for a via is mounted on a rubber elastic plane Ua; an ink filling and protruding process in which a metallizing ink 13 for the via is filled into the through hole H for the via, and in which a protrusion part 13a protruding to be dome-shaped is formed inside the through hole H for the via; and a laminating and filling process in which the ceramic green sheet G for the mounting face and another ceramic green sheet or the like are laminated and fired, and in which the laminated ceramic board comprising the protrusion part for the via protruding to be dome-shaped from the mounting face is formed. Consequently, when a solder bump on an 1C chip C is connected, it comes into contact simultaneously in one point, and the air and a flux decomposition gas are not caught into the solder bump.</p> |