| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a part of a nickel plating layer migrates and disperses to a gold plating layer surface to form nickel oxide on the gold plating layer surface, resulting in the reduction of the bond strength of solder to connection pads. SOLUTION: The wiring board is composed of an insulation base 1, a wiring layer 2 formed on the surface of and/or in the interior of the insulation base 1 and connection pads 3 formed on the base 1 surface and electrically connected to the wiring layer 2. A nickel plating layer 10 and a gold plating layer 11 are deposited in this order on the surface of the pads 3 and the diffraction strength proportion of the (111)-plane of the gold plating layer 11 is 50% or more to the total diffraction strength of the (111)-, (200)-, (220)-, (311)- and (222)-planes in X-ray diffraction. |
