| 摘要 |
PROBLEM TO BE SOLVED: To package a semiconductor device for accommodating a semiconductor element operating at a high frequency in an external electric circuit device with high reliability over a long term, and to provide a semiconductor device having low transmission loss of high frequency signal. SOLUTION: The semiconductor device comprises an insulating substrate 1 having an upper surface mounting a semiconductor element C fixedly, a lower surface on which electrode pads 1c are formed and an end face 1d on which a metallization layer 1e is formed, and a cover 5 covering the upper part of the semiconductor element C and the insulating substrate 1 and having inner side face soldered to the end face of the insulating substrate 1 through the metallization layer 1e.
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