| 摘要 |
PROBLEM TO BE SOLVED: To avoid the peel of a wiring layer and a copper plating layer or the blister of the plating layer. SOLUTION: The wiring board has a wiring layer 2 deposited to an insulation base 1 to which electrodes of electronic components 3 are connected through connecting members 5 of a low melting point solder. A copper-boron plating layer 6, a copper plating layer 7, a metal layer 8 of at least one of palladium, platinum, rhodium and ruthenium, and a gold plating layer 9 are deposited in this order on at least one surface having regions to which the electrodes of electronic components 3 are bonded through the connecting members 5.
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