| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an input device whose dimension of thickness and costs can be reduced. SOLUTION: An X electrode layer 20X and a Y electrode layer 20Y are formed through an insulating film 12 like a matrix on one side of a film substrate 10, and the edge part of the X electrode layer 20 is introduced even to the edge part of the film substrate 10. The Y electrode layer 20Y is introduced through a through-hole formed in the insulating film 12 to the edge part at the same side of the X electrode layer 20X. The electrodes of the electrode layers 20X and 20Y introduced to the edge part are connected to a conductive part 5 formed on a control circuit substrate 4. In this case, the electrodes and the conductive part 5 are bonded with insulating adhesive, in which any conductive particle is not contained, by heating and pressurization.</p> |
