| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that breakdown due to heat occurs since heat that is generated in the actuation of a semiconductor device cannot be dissipated to the outside efficiently. SOLUTION: The package for accommodating a semiconductor device comprises a board 1 that has a mount section 1a for mounting a semiconductor device 4 on the upper surface, a frame-like insulator 2 that is attached to the upper surface of the board 1 and surrounds the mount section 1a, and a lid body 3 that is attached to the frame-like insulator 2 and airtightly seals the inside of the frame-like insulator 2. The frame-like insulator 2 is made of ceramic having a thermal coefficient of expansion of 6.0 to 8.0 ppm/ deg.C (room temperature-800 deg.C). At the same time, the board 1 is made of silicon carbide and copper and has a three-layer structure. In the three-layer structure, upper and lower layers 1b and 1d made of 65 to 80 wt.% hydrocarbon and 20 to 35 wt.% copper are provided on both the surfaces of an intermediate layer 1c made of 30 to 60 wt.% hydrocarbon and 40 to 70 wt.% copper. |
