PRODUCTION METHOD FOR CIRCUIT BOARD FOR INNER LAYER

摘要

PROBLEM TO BE SOLVED: To provide a method with which a disconnection abnormality article can be easily discovered and the generation of cutting dust containing a copper foil component to become the cause of a short-circuiting defect on a multilayer printed wiring board can be prevented, when producing a circuit board for inner layer through a process for cutting a long circuit body orthogonally with a lengthwise direction with an edge tool. SOLUTION: In this production method for circuit board for inner layer, a long circuit body 1 of a portion to be cut with the edged tool on the basis of the positions of a pair of marks 3 and 3 for cutting position determination is turned into state of removing copper foil, each of a pair of marks 3 and 3 for cutting position determination is composed of two mark elements 3a and 3b made parallel in the lengthwise direction of the long circuit body 1 and made independent on both the sides of an isolation region 7, and the isolation region 7 between two mark elements 3a and 3b is cut by the edged tool.