| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent break or deformation of a wire 8 for connecting an electronic component 3 mounted on a lead frame 4 to a lead. SOLUTION: When a molten resin 16 is injected from a gate 13 which is arranged so as to connect to a mold cavity 6/7 in which an electronic component 3 mounted on a lead frame is fitted in the mold cavity 6/7, the molten resin 16 is continuously vibrated by an ultrasonic vibration mechanism 17 using ultrasonic vibration at the gate 13 while injected into the mold cavity 6/7. Herewith, the wire 8 is sealed with resin in a state substantially held in its shape. |
