| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package exhibiting excellent transmission efficiency of high frequency signal. SOLUTION: The semiconductor package comprises a basic body 1 having a part 1a for mounting a semiconductor element 5 and a circuit board 6 on the upper major surface thereof, a frame 2 having a through hole 2a in the side part and bonded to the outer circumferential part on the upper major surface of the basic body 1 to surround the mounting part 1a, and a coaxial connector 3 fitted in the through hole 2a and composed of a tubular outer circumferential conductor 3a, a central conductor 3b and an insulator 3c interposed between. A line conductor 6a connected electrically with the central conductor 3b and the semiconductor element 5 is formed on the upper surface of the circuit board 6. At the joint to the line conductor 6a, a thin part 3d having a thickness of 10-50% that of the remaining part is formed at a part of the central conductor 3b between the forward end on the line conductor 6a side and the end thereof. |
