| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that as a source electrode has an irregular shape caused by an interlayer insulating film on the gate electrode, a solder bonding layer and solder can not be applied to the whole surface of a lead and hence the bonded strength is unsatisfactory. SOLUTION: An SOG film is formed on the source electrode and etched back to bury SOG films in the recessed parts of the source electrode and the surface of the source electrode is leveled. With such a constitution, a solder bonding layer and solder are applied uniformly over the whole surface of the source electrode, so that the bonded strength between the electrode surface and a lead is enhanced.</p> |
