PRINTED WIRING BOARD, SEMICONDUCTOR MODULE, AND FIXING METHOD FOR HEAT SINK

摘要

PROBLEM TO BE SOLVED: To provide a fixing method for heat sink with which a heat sink is fixed on a printed wiring board without impairing the high density of wiring, and the like. SOLUTION: A semiconductor module comprises a printed wiring board wherein part mounting reference marks having non-conductor portions placed in low-wiring density areas formed in proximity to a semiconductor component mounting area on the surface of the wiring board; a semiconductor component mounted in the semiconductor component mounting area; and a heat sink attached to the surface of the semiconductor component. A through hole is formed in the nonconductor portions of the part mounting reference marks. A member for fixing the heat sink is inserted into the through holes, and the heat sink is thereby fixed.