LIFE OF SOLDER JOINING PART PREDICTING APPARATUS AND SYSTEM THEREFOR

摘要

PROBLEM TO BE SOLVED: To accurately predict the life of a solder joining part of an area array joining package component in response to an actually using state. SOLUTION: A solder joining part life predicting apparatus comprises a sensor board 107 for predicting the life of the solder joining part of a CSP component 105 solder-joined to a printed substrate 101 by an array-like solder ball, which has an array-like solder ball used to join a printed substrate 101, and a continuity sensor for detecting a continuity fault of the solder joining part between an own sensor board and the printed substrate 101.