| 摘要 |
PROBLEM TO BE SOLVED: To establish a manufacturing method having low costs, high productivity, and superior electric connection reliability in the manufacture of a semiconductor device, and at the same time to provide a semiconductor device manufactured by the manufacturing method and a packaging method to a wiring board. SOLUTION: A solder pump 5 is covered with a first sealing resin 6 having excellent oxide film reduction capability, and the portion between a semiconductor device 3 and a substrate 1 is filled with a second sealing resin 7 having specific physical property value.
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