发明名称 CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To prevent the disconnection of a conductive path in a circuit board and a production method therefor. SOLUTION: This circuit board is provided with a substrate 1 composed of the mixture of a fine metal oxide powder, a thermosetting resin and a pregel, conductive patterns 2 respectively provided on the front and rear faces of the substrate 1, and a through hole 4 electrically connecting the conductive patterns 2 on the front and rear faces through the substrate 1.
申请公布号 JP2003101191(A) 申请公布日期 2003.04.04
申请号 JP20010288660 申请日期 2001.09.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MURAKAMI TAKAHARU;TSUMURA TETSUYA;MIYAUCHI MICHIHIRO;YAMASHITA YOSHIHISA
分类号 H05K1/11;H05K3/06;H05K3/42;(IPC1-7):H05K3/06 主分类号 H05K1/11
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