发明名称 |
CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To prevent the disconnection of a conductive path in a circuit board and a production method therefor. SOLUTION: This circuit board is provided with a substrate 1 composed of the mixture of a fine metal oxide powder, a thermosetting resin and a pregel, conductive patterns 2 respectively provided on the front and rear faces of the substrate 1, and a through hole 4 electrically connecting the conductive patterns 2 on the front and rear faces through the substrate 1.
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申请公布号 |
JP2003101191(A) |
申请公布日期 |
2003.04.04 |
申请号 |
JP20010288660 |
申请日期 |
2001.09.21 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
MURAKAMI TAKAHARU;TSUMURA TETSUYA;MIYAUCHI MICHIHIRO;YAMASHITA YOSHIHISA |
分类号 |
H05K1/11;H05K3/06;H05K3/42;(IPC1-7):H05K3/06 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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