发明名称 MOUNTING STRUCTURE OF SEMICONDUCTOR CHIP AND LIQUID CRYSTAL DISPLAY UNIT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To maintain low wiring resistance even when wiring for driving or controlling semiconductor chips is formed on a glass board and obtain a liquid crystal display unit with a narrow casing which is excellent in display quality. SOLUTION: Part 6b of wiring 6 for driving or controlling semiconductor chips is formed on a glass board 2 as common wiring 6b used for a plurality of the semiconductor chips, so that the part of the wiring passes under a plurality of the semiconductor chips mounted in juxtaposition. The semiconductor chips mounted on the common wiring 6b are provided with connecting terminals 11B, so that the chips are connected at a plurality of points on a common- wiring-by-common-wiring 6b basis. Further, in-chip wiring 10 for parallel connection with the common wiring 6b is formed in the casing of the semiconductor chips.
申请公布号 JP2003100982(A) 申请公布日期 2003.04.04
申请号 JP20010288061 申请日期 2001.09.21
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HOSHINO SHINICHI
分类号 G02F1/1345;G09F9/00;G09F9/30;G09F9/35;H01L21/60;H01L25/04;H01L25/18;(IPC1-7):H01L25/04;G02F1/134 主分类号 G02F1/1345
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