| 摘要 |
PROBLEM TO BE SOLVED: To obtain excellent frequency characteristics of a piezoelectric vibration device by protecting a vibration region from effects of hardening/shrinking of an adhesive used in fixing the piezoelectric device inside a package by the adhesive. SOLUTION: A crystal wafer 1 is constituted by integrally forming, with a piezoelectric material, a center portion 2 provided with a main vibration portion 21, a frame-like outer frame portion 3 formed so as to surround the portion 2 with prescribed spacing from an outer periphery of the portion 2, and bridges 4, 4 and so on for partially connecting the portions 2 and 3. The portion 2 is constituted with an inverse mesa structure. A ladder-like step 25 is formed between the portion 21 and a reinforcing portion 24 which constituting the portion 2.
|
