发明名称 DEVICE FOR MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a device for mounting a substrate which is excellent in shielding property. SOLUTION: A connector 5 is constituted so that the bottom unit of a housing 1 is contacted closely with a circuit substrate 6 when the connector 5 is engaged with a partner connector 7 on the circuit substrate 6, by a method wherein the connector 5 for taking out a signal from electric parts 25 in the metallic housing 1 for receiving the electric parts 25 to the circuit substrate 6 outside of the housing 1 is provided so as to be faced to the bottom unit of the housing 1. An inlet port 26 for inserting the partner connector 7 into the bottom surface of the housing 1 is formed on the bottom surface of the housing 1, and a conductive gasket 81, contacted closely to the circuit substrate 6 is attached to the circumference of the inlet port 26. A gap upon engaging the connectors is eliminated by the gasket 81.
申请公布号 JP2003101283(A) 申请公布日期 2003.04.04
申请号 JP20010287517 申请日期 2001.09.20
申请人 HITACHI CABLE LTD 发明人 KOBAYASHI MASAHIKO;KOMATSUZAKI KAZUHIRO;MIZOBUCHI KENJI;TAKAHASHI RYUTA;TAMURA KENICHI
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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