发明名称 PLASMA TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which can easily control and set up the adequate state of multipole magnetic fields corresponding to the kind of the plasma treatment, and can easily execute a good treatment. SOLUTION: In each magnetic segment 22 of a magnetic field forming mechanism 21, as shown in Fig. 3 (a), starting from a state wherein magnetic poles of each magnetic segment 22 face vacuum chamber 1, as shown in Fig. 3 (b), Fig. 3 (c), adjacent magnetic segments 22 synchronously rotate in the counter direction, namely, every other magnetic segments 22 rotate in the same direction, which makes it possible to control the state of the multipole magnetic fields formed around a semiconductor wafer W in the vacuum chamber 1.
申请公布号 JP2003100716(A) 申请公布日期 2003.04.04
申请号 JP20010287539 申请日期 2001.09.20
申请人 TOKYO ELECTRON LTD 发明人 ONO HIROO;TATSUSHITA KOICHI;HONDA MASANOBU;NAGASEKI KAZUYA;HAYASHI DAISUKE
分类号 H05H1/46;C23F1/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;H01L21/31 主分类号 H05H1/46
代理机构 代理人
主权项
地址