IC CARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an IC card capable of being mass-produced at a low cost even for card base materials formed of various types of materials. SOLUTION: An IC chip 3 is mounted on one surface 2a of the card substrate 2 so that an electrode terminal part is exposed to the other surface 2b through a through-hole 5, and an antenna coil 4 directly and electrically connected to the electrode terminal part of the IC chip 3 by thermally spraying metal material through a conductive film 7 including the through-hole 5 is formed on the other surface 2b.