发明名称 APPARATUS FOR POSITIONING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To protect an electronic component against cracking due to pressure at the time of mounting by sucking the electronic component accurately. SOLUTION: The positioning pin 21 of a positioning mechanism and the movable pin 31 of a positioning movable mechanism are moved by means of first and second spring members 29 and 39. A suction head 51 sucks an electronic component 11 from the frame part 51a thereof without projecting it. When the electronic component 11 is sucked by the suction head 51, it is sucked while pushing down the positioning pin 21 and the movable pin 31 slightly by means of the frame part 51a. The movable pin 31 is released when the outer circumferential part of the electronic component 11 slightly enters the frame part 51a.
申请公布号 JP2003101298(A) 申请公布日期 2003.04.04
申请号 JP20010296622 申请日期 2001.09.27
申请人 NEC CORP 发明人 MURATA KAZUHITO
分类号 B25J15/06;B23P19/00;H05K13/04 主分类号 B25J15/06
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