SOLDER BALL AND COMPONENT CONNECTING STRUCTURE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a solder ball which can easily attain the desired amount of supply of solder even when thickness of solder layer formed at the external surface of the core is not increased. SOLUTION: The solder ball comprises the core 11 where a plurality of recessed areas 13 are formed at the external surface and the solder layer 12 covering the external surface of the core 11. The solder layer 12 fills the inside of each recessed area 13. The volume of the solder layer 12 increases in comparison with that of the solder ball where the external surface of the core including no recessed area is covered with the solder layer of the equal thickness. Amount of supply of solder can be supplemented by the part 12a filling the internal side of each recessed area 13 of the solder layer 12.