| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that, as to a conventional semiconductor device along with its manufacturing method, it has projective electrodes such as bump electrodes and hence the bond zones of the electrodes of the semiconductor device to electrodes on a mounting board are broken in connection of the semiconductor device to the board, resulting in that mounting reliability is not obtained. SOLUTION: The semiconductor device 21 has a resin seal body 27 with a lead 23 partly exposed as a terminal 28 from the backside of the body 27 and both ends 231, 232 of the lead 23 are integrated with the body 27. Thus the terminal 28 does not cause an electrode failure, etc., according to the semiconductor device and its manufacturing method.</p> |
