发明名称 DEVICE MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To dispense with chip jumper connection when a plurality of devices are mounted on a printed board by serial connection either with a wide pitch or narrow pitch. SOLUTION: Multiple devices 11 of a light receiving IC are arrayed for a light receiver installed opposed to a projector in which multiple light-emitting elements are arrayed. A plurality of devices 11 are mounted on a printed board 12 by serial connection either with a narrow pitch shown in Fig. 1 (A) or with a wide pitch shown in Fig. 1 (B). The printed board 12 is provided with a first print pattern 13 used for inter-device connection at wide-pitch mounting, and a second print pattern 14 used for inter-device connection at narrow-pitch mounting. According to the mounting pitch of the device 11, either the print pattern 13 or the print pattern 14 is connected to the device 11 by a bonding wire 15.
申请公布号 JP2003101172(A) 申请公布日期 2003.04.04
申请号 JP20010285586 申请日期 2001.09.19
申请人 SUNX LTD;ASAHI MATSUSHITA ELECTRIC WORKS LTD 发明人 MATSUNAGA YOSHIYUKI
分类号 H05K1/18;H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/18
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