| 摘要 |
PROBLEM TO BE SOLVED: To prevent wiring accuracy from being lowered by etching fine wiring already, molded as well when etching a thin metal layer in semi-additive method (FAM: foil additive method) for forming fine wiring, by removing the thin metal layer on the surface of an insulating substrate after adding the thin metal layer on the surface of the substrate, and forming a wiring pattern with electric plating. SOLUTION: In the FAM method, a roughened thin metal layer 2 of Ni or Ti except for copper having the thickness of <=5μm is previously added on one side of copper foil 1 having a smooth surface, the roughened thin metal layer 2 having the thickness of <=5μm is added on the surface of the substrate by removing the copper foil 1 after laminating a thin metal face 2 through a resin to a substrate 3, a resist 5 is removed by performing pattern electric plating after forming the pattern electric plating resist 5, and this production method for printed wiring board has a process for removing the thin metal layer 2 except for the pattern part by etching at least.
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