| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique by which the quantitative evaluation of the dressing amount of a pad can be performed in-situ during CMP. SOLUTION: A semiconductor device manufacturing device polishes a wafer 2 by rotating both the wafer 2 and the pad 8 while the wafer 2 is pressed against the pad 8. In the manufacturing device, a surface cleaner 20 and a measuring instrument 21 are provided closely to each other in this order along the direction of rotation of the pad 8 in the rear of a conditioner 12 which dresses the pad 8. In a method of manufacturing semiconductor device using the manufacturing device, the surface state of the pad 8 is measured in parallel with the polishing operation performed on the wafer 2, and the dressing is performed based on the measured results. When this constitution is used, the state of the pad 8 can be monitored during polishing operation. Consequently, the polishing rate of the wafer 2 is stabilized by performing appropriate dressing and, in addition, the excessive consumption of a dresser and a pad material caused by excessive dressing can be prevented. |
