| 摘要 |
PROBLEM TO BE SOLVED: To prevent the deterioration of the heat radiation of a ceramic circuit board due to penetration of bubbles into a heat conductive composition between the circuit board and a radiating member, since a semiconductor element generates heat to warp the circuit board. SOLUTION: The ceramic circuit board 1 is composed of a metal circuit board 3 fixed onto the upside of a ceramic board 2 and a dummy metal circuit board 4 fixed onto the other side opposite to the circuit board 3, and the dummy board 4 is mounted on a heat radiating member 7 through a heat conductive composition 6. The gap of the dummy board 4 corresponding to a space between circuits of the circuit board 3 is filled with an insulative resin 5 having a Young' s modulus of 20 GPa or less so as to make the gap of the dummy board 4 flush, thereby preventing bubbles from penetrating into the gap corresponding to the space between the circuits of the dummy board 4. |
