| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a void is formed inside a through-conductor formed on a glass ceramic substrate, a void is formed in a gap with a substrate around the through-conductor, a substrate is cracked or through-conductor is bent protrudingly. SOLUTION: In the composition for through-conductor for forming a through- conductor 2 inside a glass ceramic substrate 1 formed at 800 to 950 deg.C, the inorganic component of this composition is composed of a main part in 97-99 wt.% composed of Ag powder in 80-90 wt.% having the particle diameter from 3 to 7μm in 50% of integration and a particle diameter >=2μm in 10% of integration, and glass powder in 10-20 wt.% having a softening point higher than the sintering temperature of the glass ceramic substrate 1 for 10 to 60 deg.C and alumina powder in 1-3 wt.%. By matching timing to sinter/shrink the glass ceramic substrate 1 and the through-conductor 2, the problem such as occurrence of void in the through-conductor 2 or occurrence of void with the substrate 1 around the through-conductor 2 does not occur. |
