| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment for preventing the generation of passivation cracks. SOLUTION: In a film substrate, an 8μm copper foil is formed on a polyimide film with a thickness of 25μm by a deposition method. The copper foil is subjected to patterning, inner leads A1 and B2 are formed, and electroless tin plating is formed on a surface. The area of a bump 4 at the side of an inner lead B3 is set to approximately 40% to the area of the bump 4 at the side of an inner lead A1. At the junction section between the inner leads A1 and B3, a notch 2 is formed.
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