发明名称 CONDUCTIVE CONNECTION METHOD AND MOLD RELEASE SHEET THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a conductive connection method for preventing strain in a mold release sheet due to heating and connection failure in an object to be connected due to the generation of wrinkling from being generated easily, and at the same time connecting the object to be connected for short tact time reliably, and to provide the mold release sheet used for the conductive connection method. SOLUTION: In the conductive connection method for allowing the electrodes of objects 4 and 6 to be connected to be subjected to conductive connection via an anisotropic conductive material 5, by heating and pressurizing due to a contact bonding method 1 by interposing a mold release sheet 3. The mold release sheet 3 should have metal foil and a fluororesin layer that is provided at least at the one side.</p>
申请公布号 JP2003100807(A) 申请公布日期 2003.04.04
申请号 JP20010295298 申请日期 2001.09.27
申请人 NITTO DENKO CORP 发明人 TACHIBANA TOSHIMITSU
分类号 H01R43/00;H01L21/60;H05K3/32;(IPC1-7):H01L21/60 主分类号 H01R43/00
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