发明名称 PACKAGE STRUCTURE FOR PIEZOELECTRIC FILTER
摘要 PROBLEM TO BE SOLVED: To solve a drawback in which deterioration in characteristics of a piezoelectric filter is generated by a parasitic effect due to an increase of an electric resistance or a stray capacitance of an electric finger caused by a long size of a wiring pattern constituting an extraction electrode, by shortening the length of the extraction electrode as much as possible. SOLUTION: In a piezoelectric filter in which an SAW (Surface Acoustic Wave) filter element 4 and an electronic component 5 are housed in the same package, the package is provided with a package main body having a recessed portion on its top surface and a lid 6 fixed on an outer frame top surface of the package main body to seal the recessed portion. In this filter, a piezoelectric substrate constituting the element 4 is mounted on the inner bottom surface so as to cover an electronic component housing recessed portion 30, and the direction of the rectangular portion 30 is so set that one of two diagonals is parallel to the front and rear directions of the piezoelectric board.
申请公布号 JP2003101379(A) 申请公布日期 2003.04.04
申请号 JP20010291415 申请日期 2001.09.25
申请人 TOYO COMMUN EQUIP CO LTD 发明人 YAMANAKA KUNIHITO
分类号 H03H9/25;(IPC1-7):H03H9/25 主分类号 H03H9/25
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