发明名称 SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain a surface acoustic wave device which protects its functional portion, and is highly reliable, small and lightweight. SOLUTION: A surface acoustic wave element is mounted on a circuit board. The element has a frame-like first insulating film 2a which is provided to surround a functional portion 1a on a chip 1, and a lid-like second insulating film 2b which is deposited on the film 2a, secures a hollow portion over the portion 1a and covers an excitation electrode and a surface wave propagation path of the portion 1a.
申请公布号 JP2003101380(A) 申请公布日期 2003.04.04
申请号 JP20020198456 申请日期 2002.07.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORISHIMA KOJI
分类号 H03H9/25;(IPC1-7):H03H9/25 主分类号 H03H9/25
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