SEMICONDUCTOR WAFER TEST METHOD AND SEMICONDUCTOR WAFER TESTER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer test method and a semiconductor wafer tester which can compensate the unevenness of electric characteristics on a holding surface of a sample chuck. SOLUTION: The wafer tester 1 has the sample chuck 2 for holding a wafer 13 on the holding surface 18 and a probe 50 for inspecting electric characteristics of the holding surface 18 and the surface of the wafer 13. The sample chuck 2 has a basic structure body 4 made of conductive metal and a semiconductor layer 6 forming the holding surface 18. After a correction factor corresponding to the position of the surface of the semiconductor layer is determined by a measuring means 60, the electric characteristics in an arbitrary position on the wafer 13 are measured to avoid the influence of the electric characteristics of the semiconductor layer and the basic structure body by using the correction factor of the corresponding position.