THIN-FILM FORMING DEVICE AND THIN-FILM FORMING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thin-film forming device and a thin-film forming method which can transfer plural thin films to a substrate in a few times of transferring, can simplify a process thereby and can reduce the cost of a thin-film forming treatment, accordingly. SOLUTION: A wafer 20 and a transfer sheet 30 are located facing each other. A multilayer wiring thin-film structure 40 consisting of plural thin-film layers 41, is formed on a surface of the transfer sheet 30. The multilayer wiring thin-film structure 40 is transferred to the wafer 20, when the wafer 20 and the transfer sheet 30 are brought into close contact and only the transfer sheet 30 is peeled then.