| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composite semiconductor device using a metal base plate which has thermal resistance with a good solder contact and does not crack against mechanical stress exerted on the circumference of an insulation board. SOLUTION: The composite semiconductor device has electric circuit constituent components such as insulation board 4, external electrodes 5, 8, a semiconductor element 6, a heat buffer plate 7, etc., all mounted and fixed onto a metal base plate 1 previously bent into an upward convex shape with a bonding material 13 such as solder. The upside of the base plate 1 for mounting and fixing the electronic components thereto has a flat surface 1d, without forming a curved surface.
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